Applications
Epoxy Resins
Formulation, preparation, and application of materials for Epoxy Resins
Epoxies are widely used for applications adhesives, protective marine coatings, gap fill materials & liquid shims, composites, encapsulants & potting compounds, mold making, conductive or insulative electronic materials, and even high-performance cementitious materials like epoxy-based grouts. They are generally two components (resin and hardener). This makes epoxies naturally easy to work with and allows them to be easily modified with a wide variety of additives to achieve high strength, durability, lighter weight, reduced slump, fast cure, and other desirable performance characteristics.
The keys to unlocking maximum performance with most epoxy systems are to use the correct ratio of resin to hardener, mix thoroughly, and remove bubbles/voids from the material. Once the resin and hardener are combined they begin to react, so high speed mixing will maximize working time. A programmable system is recommended to ensure that the process is repeatable and that consistent, high quality results can be achieved. Vacuum mixing is recommended for conductive or insulative systems, heat cured systems, or any materials that will be used in space-based applications.
Why Hauschild SpeedMixer®
- Epoxy based adhesives are often used in place of or in addition to traditional fasteners. They provide a strong and permanent bond to a variety of materials like metals, ceramics, composites, and foams. They may be mixed with rheology modifiers like fumed silica, flocking for reinforcement, or beads to control the thickness of adhesive between bonded surfaces.
- To achieve the strongest possible bond, surfaces being bonded must be prepared by cleaning & sometimes roughening, epoxy components and additives must be weighed at the correct ratio as specified by the manufacturer, and the system must be mixed thoroughly. A vacuum degassing procedure is also often used to remove bubbles, dissolved gasses, or volatile content that could otherwise create voids or outgas. Once mixed, the epoxy will start to react and must be applied within the “working time” before it begins to gel or harden. The adhesives can often be packaged into cartridges to make application easier and faster so that nearly all the material can be used within the working time and waste is minimized.
Reduce operational costs with energy-efficient machines designed for rapid and thorough mixing, ensuring no unwanted bubbles & voids.
Easily scale your production from small batches to large quantities while maintaining uniformity and quality.
Our mixers handle a wide range of applications, including dispersing rheology modifiers like fumed silica and incorporating structures like hollow glass micro balloons to reduce density.
Hauschild Engineering Announces Expanded Support
for SpeedMixer™ Customers
Applications
Regardless of industry, Hauschild SpeedMixer® performs beautifully
